Wire-Bonding and on-wafer testing

Substrate wire bounding facility is available in a semi cleanroom environment. We have experience in micro bonding on- and with various materials of RF microchips using a "West Bond" bonding machine. Other in house microchip experience are substrate fixing and wafer probing including full wafer S-parameter measurements.

 

Design: Kuenst.    Development: Dripl.    © 2020 ASTRON